Barrier-Less Structures

ABSTRACT

Interconnect structures and method of forming the same are disclosed herein. An exemplary interconnect structure includes a first contact feature in a first dielectric layer, a second dielectric layer over the first dielectric layer, a second contact feature over the first contact feature, a barrier layer between the second dielectric layer and the second contact feature, and a liner between the barrier layer and the second contact feature. An interface between the first contact feature and the second contact feature includes the liner but is free of the barrier layer.

PRIORITY DATA

This application is a divisional application of U.S. patent applicationSer. No. 16/547,763, filed Aug. 22, 2019, which is hereby incorporatedherein by reference in its entirety.

BACKGROUND

The integrated circuit (IC) industry has experienced exponential growth.Technological advances in IC materials and design have producedgenerations of ICs, where each generation has smaller and more complexcircuits than the previous generation. In the course of IC evolution,functional density (i.e., the number of interconnected devices per chiparea) has generally increased while geometry size (i.e., the smallestcomponent (or line) that can be created using a fabrication process) hasdecreased. This scaling down process generally provides benefits byincreasing production efficiency and lowering associated costs.

Such scaling down has also increased the complexity of processing andmanufacturing ICs and, for these advances to be realized, similardevelopments in IC processing and manufacturing are needed. For example,as multilayer interconnect (MLI) features become more compact withever-shrinking IC feature size, interconnects of the MLI features areexhibiting increased contact resistance, which presents performance,yield, and cost challenges. It has been observed that higher contactresistances exhibited by interconnects in advanced IC technology nodescan significantly delay (and, in some situations, prevent) signals frombeing routed efficiently to and from IC devices, such as transistors,negating any improvements in performance of such IC devices in theadvanced technology nodes. Accordingly, although existing interconnectshave been generally adequate for their intended purposes, they have notbeen entirely satisfactory in all respects.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure is best understood from the following detaileddescription when read with the accompanying figures. It is emphasizedthat, in accordance with the standard practice in the industry, variousfeatures are not drawn to scale and are used for illustration purposesonly. In fact, the dimensions of the various features may be arbitrarilyincreased or reduced for clarity of discussion.

FIGS. 1A and 1B are a flow chart of a method for fabricating aback-end-of-line (BEOL) interconnect structure of a multilayerinterconnect feature according to various aspects of the presentdisclosure.

FIGS. 2, 3, 4A-4B, 5A-5B, 6A-6B, 7A-7C, 8A-8C, 9A-9C, and 10-13 arefragmentary cross-sectional views of an interconnect structure of asemiconductor device at various stages of fabrication, according tovarious aspects of the present disclosure.

FIGS. 14A and 14B are a flow chart of a method for fabricating amiddle-end-of-line (MEOL) contact structure according to various aspectsof the present disclosure.

FIGS. 15, 16, 17A, 17B, 18A, 18B, 19A, 19B, 20A, 20B, 21A, 21B, 22A, and22B are fragmentary cross-sectional views of a MEOL contact structure ofa semiconductor device at various stages of fabrication, according tovarious aspects of the present disclosure.

DETAILED DESCRIPTION

The present disclosure relates generally to integrated circuit (IC)devices, and more particularly, to multi-layer interconnect features ofIC devices.

The following disclosure provides many different embodiments, orexamples, for implementing different features of the invention. Specificexamples of components and arrangements are described below to simplifythe present disclosure. These are, of course, merely examples and arenot intended to be limiting. For example, the formation of a firstfeature over or on a second feature in the description that follows mayinclude embodiments in which the first and second features are formed indirect contact, and may also include embodiments in which additionalfeatures may be formed between the first and second features, such thatthe first and second features may not be in direct contact.

In addition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.Moreover, the formation of a feature on, connected to, and/or coupled toanother feature in the present disclosure that follows may includeembodiments in which the features are formed in direct contact, and mayalso include embodiments in which additional features may be formedinterposing the features, such that the features may not be in directcontact. In addition, spatially relative terms, for example, “lower,”“upper,” “horizontal,” “vertical,” “above,” “over,” “below,” “beneath,”“up,” “down,” “top,” “bottom,” etc. as well as derivatives thereof(e.g., “horizontally,” “downwardly,” “upwardly,” etc.) are used for easeof the present disclosure of one features relationship to anotherfeature. The spatially relative terms are intended to cover differentorientations of the device including the features.

IC manufacturing process flow is typically divided into threecategories: front-end-of-line (FEOL), middle-end-of-line (MEOL), andback-end-of-line (BEOL). FEOL generally encompasses processes related tofabricating IC devices, such as transistors. For example, FEOL processescan include forming isolation features, gate structures, and source anddrain features (generally referred to as source/drain features). MEOLgenerally encompasses processes related to fabricating contacts toconductive features (or conductive regions) of the IC devices, such ascontacts to the gate structures and/or the source/drain features. BEOLgenerally encompasses processes related to fabricating a multilayerinterconnect (MLI) feature that interconnects IC features fabricated byFEOL and MEOL (referred to herein as FEOL and MEOL features orstructures, respectively), thereby enabling operation of the IC devices.

As IC technologies progress towards smaller technology nodes, MEOL andBEOL processes are experiencing significant challenges. For example,advanced IC technology nodes require more compact MLI features, whichrequires significantly reducing critical dimensions of interconnects ofthe MLI features (for example, widths and/or heights of vias and/orconductive lines of the interconnects). The reduced critical dimensionshave led to significant increases in interconnect resistance, which candegrade IC device performance (for example, by increasingresistance-capacitance (RC) delay). Barrier-free vias have been proposedto replace conventional vias to lower interconnect resistance foradvanced IC technology nodes. Conventional vias include a via barrierlayer and a via plug, where the via barrier layer is disposed between(1) the via plug and an underlying interconnect feature (such as adevice-level contact or a conductive line) and (2) the via plug and adielectric layer (for example, an interlayer dielectric (ILD) layerand/or a contact etch stop layer (CESL)) in which the via is disposed.Barrier-free vias eliminate the barrier layer and/or any other linerlayer, such that the via plug directly contacts the underlyinginterconnect feature and the dielectric layer. Eliminating the barrierlayer (along with other liner layers) increases a volume of the viaplug, lowering resistance.

Though barrier-free vias exhibit desirably low resistance, sometimes,via plug materials, such as tungsten, cobalt, and/or ruthenium, do notadhere well to the dielectric layer, such that gaps (or voids) existbetween the via plug and the dielectric layer. Poor adhesion of the viaplug to the dielectric layer (in particular, to sidewall surfaces and/orbottom surfaces of a via opening in which the via plug is formed) canlead to significant damage of the underlying contact and interconnectfeature. When polishing the via plug materials (for example, by achemical mechanical polishing (CMP) process), slurry used during thepolishing has been observed to penetrate an interface between the viaplug and the dielectric layer, seep through the gaps between the viaplug and the dielectric layer, and attack material of the underlyingcontact or interconnect feature (in particular, cobalt), degrading itsperformance. Such performance degradation can be calamitous fordevice-level contacts. For example, cobalt loss arising from exposure tochemicals during BEOL processing, such as CMP slurry (which is typicallyan acidic solution (in some implementations, having a pH value of about2)), have been observed to cause significant yield loss of underlyinginterconnect features, which is unacceptable for meeting shrinking ICtechnology node demands. Planarization-induced delamination or peelingof the via plug materials, particularly at a wafer periphery, have alsobeen observed as a result of the poor adhesion between the via plugmaterials and the dielectric layer. In addition, via plugs of theconventional barrier-free vias may have higher resistance thanconventional via plugs.

The present disclosure discloses low-resistance vias and metal linestructures (collectively, contact structures) that protect underlyinginterconnect features (for example, device-level contacts and/orconductive lines) and reduce resistance. In some embodiments of thepresent disclosure, the low-resistance contact structures includebarrier layers on sidewalls of the metal lines that prevent CMP slurriesfrom penetrating through the interface between the vias and a dielectriclayer. In some implementations, after a first contact feature in a firstdielectric layer is exposed in a via opening at a bottom surface of atrench, a self-assembled monolayer (SAM) is selectively formed on atop-facing surface of the exposed first contact feature to inhibitformation of a barrier layer and allow selective formation of thebarrier layer on the sidewalls of the via opening and trench. In someother implementations, a contact via underneath a metal line is abarrier-free via formed using a bottom-up deposition technique andplanarization is performed to a metal line disposed over the contactvia. Different embodiments may have different advantages, and noparticular advantage is required of any embodiment.

FIGS. 1A and 1B illustrate a flow chart of a method 100 for fabricatinga BEOL interconnect structure of a semiconductor device according tovarious aspects of the present disclosure. FIGS. 2, 3, 4A-4B, 5A-5B,6A-6B, 7A-7C, 8A-8C, 9A-9C, and 10-13 are fragmentary cross-sectionalviews of an interconnect structure of a semiconductor device at variousstages of fabrication according to various embodiments of method 100 ofthe present disclosure. Additional steps can be provided before, during,and after method 100, and some of the steps described can be moved,replaced, or eliminated for additional embodiments of method 100.Additional features can be added in the interconnect structure depictedin FIGS. 2, 3, 4A-4B, 5A-5B, 6A-6B, 7A-7C, 8A-8C, 9A-9C, and 10-13, andsome of the features described below can be replaced, modified, oreliminated in other embodiments of the interconnect structure depictedin FIGS. 2, 3, 4A-4B, 5A-5B, 6A-6B, 7A-7C, 8A-8C, 9A-9C, and 10-13.

Referring to FIG. 1A and FIG. 2, the method 100 includes a block 102where a contact feature, such as one of the contact features 1000, 2000,or 3000, is formed in a first dielectric layer 212 of an interconnectstructure 200 in a semiconductor device 20. The first dielectric layer212 may be a first interlayer dielectric (ILD) layer formed over thesemiconductor device 20 in a workpiece. The semiconductor device 20 canbe included in a microprocessor, a memory, and/or other IC device. Insome implementations, the semiconductor device 20 is a portion of an ICchip, a system on chip (SoC), or portion thereof, that includes variouspassive and active microelectronic devices, such as resistors,capacitors, inductors, diodes, p-type field effect transistors (PFETs),n-type field effect transistors (NFETs), metal-oxide semiconductor fieldeffect transistors (MOSFETs), complementary metal-oxide semiconductor(CMOS) transistors, bipolar junction transistors (BJTs), laterallydiffused MOS (LDMOS) transistors, high voltage transistors, highfrequency transistors, other suitable components, or combinationsthereof. The transistors may be planar transistors or multi-gatetransistors, such as fin-like FETs (FinFETs). FIG. 2 has been simplifiedfor the sake of clarity to better understand the inventive concepts ofthe present disclosure. Additional features can be added in thesemiconductor device 20, and some of the features described below can bereplaced, modified, or eliminated in other embodiments of thesemiconductor device 20.

The semiconductor device 20 includes a substrate (wafer) 22. In thedepicted embodiment, substrate 22 includes silicon. Alternatively oradditionally, substrate 22 includes another elementary semiconductor,such as germanium; a compound semiconductor, such as silicon carbide,gallium arsenide, gallium phosphide, indium phosphide, indium arsenide,and/or indium antimonide; an alloy semiconductor, such as silicongermanium (SiGe), GaAsP, AlInAs, AlGaAs, GaInAs, GaInP, and/or GaInAsP;or combinations thereof. In some implementations, substrate 22 includesone or more group III-V materials, one or more group II-IV materials, orcombinations thereof. In some implementations, substrate 22 is asemiconductor-on-insulator substrate, such as a silicon-on-insulator(SOI) substrate, a silicon germanium-on-insulator (SGOI) substrate, or agermanium-on-insulator (GOI) substrate. Semiconductor-on-insulatorsubstrates can be fabricated using separation by implantation of oxygen(SIMOX), wafer bonding, and/or other suitable methods. Substrate 22 caninclude various doped regions (not shown) configured according to designrequirements of semiconductor device 20, such as p-type doped regions,n-type doped regions, or combinations thereof. P-type doped regions (forexample, p-type wells) include p-type dopants, such as boron, indium,other p-type dopant, or combinations thereof. N-type doped regions (forexample, n-type wells) include n-type dopants, such as phosphorus,arsenic, other n-type dopant, or combinations thereof. In someimplementations, substrate 22 includes doped regions formed with acombination of p-type dopants and n-type dopants. The various dopedregions can be formed directly on and/or in substrate 22, for example,providing a p-well structure, an n-well structure, a dual-wellstructure, a raised structure, or combinations thereof. An ionimplantation process, a diffusion process, and/or other suitable dopingprocess can be performed to form the various doped regions. Forsimplicity, the substrate 22 is not illustrated in FIGS. 3, 4A-4B,5A-5B, 6A-6B, 7A-7C, 8A-8C, 9A-9C, and 10-13.

An isolation feature(s) (not shown) is formed over and/or in substrate22 to isolate various regions, such as various device regions, ofsemiconductor device 20. For example, isolation features define andelectrically isolate active device regions and/or passive device regionsfrom each other. Isolation features include silicon oxide, siliconnitride, silicon oxynitride, other suitable isolation material, orcombinations thereof. Isolation features can include differentstructures, such as shallow trench isolation (STI) structures, deeptrench isolation (DTI) structures, and/or local oxidation of silicon(LOCOS) structures. In some implementations, isolation features includeSTI features. For example, STI features can be formed by etching atrench in substrate 22 (for example, by using a dry etch process and/orwet etch process) and filling the trench with insulator material (forexample, by using a chemical vapor deposition (CVD) process or a spin-onglass process). A chemical mechanical polishing (CMP) process may beperformed to remove excessive insulator material and/or planarize a topsurface of isolation features. In some embodiments, STI features includea multi-layer structure that fills the trenches, such as a siliconnitride layer disposed over an oxide liner layer.

While not shown, various gate structures are disposed over the substrate22 and one or more of them interpose a source region and a drain region,where a channel region is defined between the source region and thedrain region. The one or more gate structures engage the channel region,such that current can flow between the source/drain regions duringoperation. In some implementations, gate structures are formed over afin structure, such that gate structures each wrap a portion of the finstructure. For example, one or more of gate structures wrap channelregions of the fin structure, thereby interposing source regions anddrain regions of the fin structure. In some embodiments, gate structuresinclude metal gate (MG) stacks that are configured to achieve desiredfunctionality according to design requirements of the semiconductordevice 20. In some implementations, metal gate stacks include a gatedielectric and a gate electrode over the gate dielectric. The gatedielectric includes a dielectric material, such as silicon oxide, high-kdielectric material, other suitable dielectric material, or combinationsthereof. High-k dielectric material generally refers to dielectricmaterials having a high dielectric constant, for example, greater than adielectric constant of silicon oxide (k≈3.9). Exemplary high-kdielectric materials include hafnium, aluminum, zirconium, lanthanum,tantalum, titanium, yttrium, oxygen, nitrogen, other suitableconstituent, or combinations thereof. In some implementations, the gatedielectric includes a multilayer structure, such as an interfacial layerincluding, for example, silicon oxide, and a high-k dielectric layerincluding, for example, HfO₂, HfSiO, HfSiON, HfTaO, HfTiO, HfZrO, ZrO₂,Al₂O₃, HfO₂—Al₂O₃, TiO₂, Ta₂O₅, La₂O₃, Y₂O₃, other suitable high-kdielectric material, or combinations thereof. The gate electrodeincludes an electrically conductive material. In some implementations,the gate electrode includes multiple layers, such as one or more cappinglayers, work function layers, glue/barrier layers, and/or metal fill (orbulk) layers. A capping layer can include a material that prevents oreliminates diffusion and/or reaction of constituents between the gatedielectric and other layers of the gate electrode. In someimplementations, the capping layer includes a metal and nitrogen, suchas titanium nitride (TiN), tantalum nitride (TaN), tungsten nitride(W₂N), titanium silicon nitride (TiSiN), tantalum silicon nitride(TaSiN), or combinations thereof. A work function layer includes aconductive material tuned to have a desired work function (such as ann-type work function or a p-type work function), such as n-type workfunction materials and/or p-type work function materials. P-type workfunction materials include TiN, TaN, Ru, Mo, Al, WN, ZrSi₂, MoSi₂,TaSi₂, NiSi₂, WN, other p-type work function material, or combinationsthereof. N-type work function materials include Ti, Al, Ag, Mn, Zr,TiAl, TiAlC, TaC, TaCN, TaSiN, TaAl, TaAlC, TiAlN, other n-type workfunction material, or combinations thereof. A glue/barrier layer caninclude a material that promotes adhesion between adjacent layers, suchas the work function layer and the metal fill layer, and/or a materialthat blocks and/or reduces diffusion between gate layers, such as thework function layer and the metal fill layer. For example, theglue/barrier layer includes metal (for example, W, Al, Ta, Ti, Ni, Cu,Co, other suitable metal, or combinations thereof), metal oxides, metalnitrides (for example, TiN), or combinations thereof. A metal fill layercan include a suitable conductive material, such as Al, W, and/or Cu.

Epitaxial source features and epitaxial drain features (referred to asepitaxial source/drain features) may be disposed in source/drain regionsof substrate 22. Gate structure and epitaxial source/drain features forma portion of a transistor of the semiconductor device 20. Gate structureand/or epitaxial source/drain features are thus alternatively referredto as device features. In some implementations, epitaxial source/drainfeatures wrap source/drain regions of a fin structure. An epitaxyprocess can implement CVD deposition techniques (for example,vapor-phase epitaxy (VPE), ultra-high vacuum CVD (UHV-CVD), LPCVD,and/or PECVD), molecular beam epitaxy, other suitable SEG processes, orcombinations thereof. Epitaxial source/drain features may be doped withn-type dopants and/or p-type dopants. In some implementations, where thetransistor is configured as an n-type device (for example, having ann-channel), epitaxial source/drain features can be silicon-containingepitaxial layers or silicon-carbon-containing epitaxial layers dopedwith phosphorous, other n-type dopant, or combinations thereof (forexample, forming Si:P epitaxial layers or Si:C:P epitaxial layers). Insome implementations, where the transistor is configured as a p-typedevice (for example, having a p-channel), epitaxial source/drainfeatures can be silicon-and-germanium-containing epitaxial layers dopedwith boron, other p-type dopant, or combinations thereof (for example,forming Si:Ge:B epitaxial layers). In some implementations, annealingprocesses are performed to activate dopants in epitaxial source/drainfeatures of the semiconductor device 20.

In some implementations, silicide layers are formed on epitaxialsource/drain features. In some implementations, silicide layers areformed by depositing a metal layer over epitaxial source/drain features.The metal layer includes any material suitable for promoting silicideformation, such as nickel, platinum, palladium, vanadium, titanium,cobalt, tantalum, ytterbium, zirconium, other suitable metal, orcombinations thereof. The semiconductor device 20 is then heated (forexample, subjected to an annealing process) to cause constituents ofepitaxial source/drain features (for example, silicon and/or germanium)to react with the metal. The silicide layers thus include metal and aconstituent of epitaxial source/drain features (for example, siliconand/or germanium). In some implementations, the silicide layers includenickel silicide, titanium silicide, or cobalt silicide. Any un-reactedmetal, such as remaining portions of the metal layer, is selectivelyremoved by any suitable process, such as an etching process.

The interconnect structure 200 is disposed over substrate 22. Theinterconnect structure 200 may electrically couple various devices (forexample, transistors, resistors, capacitors, and/or inductors) and/orcomponents (for example, gate structures and/or source/drain features)of the semiconductor device 20, such that the various devices and/orcomponents can operate as specified by design requirements of thesemiconductor device 20. The interconnect structure 200 includes acombination of dielectric layers and electrically conductive layers (forexample, metal layers) configured to form various interconnectstructures. The conductive layers are configured to form verticalinterconnect features (providing, for example, vertical connectionbetween features and/or vertical electrical routing), such as contactsand/or vias, and/or horizontal interconnect features (providing, forexample, horizontal electrical routing), such as conductive lines (ormetal lines). Vertical interconnect features typically connecthorizontal interconnect features in different layers the interconnectstructure 200. During operation, the interconnect features areconfigured to route signals between the devices and/or the components ofthe semiconductor device 20 and/or distribute signals (for example,clock signals, voltage signals, and/or ground signals) to the devicesand/or the components of the semiconductor device 20. Though theinterconnect structure 200 is depicted with a given number of dielectriclayers and conductive layers, the present disclosure contemplates theinterconnect structure 200 having more or less dielectric layers and/orconductive layers.

Referring still to FIG. 2, the interconnect structure 200 includes oneor more dielectric layers (i.e. ILD layers), such as the firstdielectric layer 212 and other dielectric layers over the firstdielectric layer 212. These dielectric layers include a dielectricmaterial including, for example, silicon oxide, silicon nitride, siliconoxynitride, TEOS formed oxide, PSG, BPSG, low-k dielectric material,other suitable dielectric material, or combinations thereof. Exemplarylow-k dielectric materials include FSG, carbon doped silicon oxide,Black Diamond® (Applied Materials of Santa Clara, Calif.), Xerogel,Aerogel, amorphous fluorinated carbon, Parylene, BCB, SiLK (DowChemical, Midland, Mich.), polyimide, other low-k dielectric material,or combinations thereof. In some embodiments, the interconnect structure200 may also include one or more contact etch stop layers (CESL)disposed over substrate 22, such as a first CESL 210 under the firstdielectric layer 212, a second CESL 220 over the first dielectric layer212, and other CESLs over the second CESL 220. CESLs include a materialdifferent than the ILD layers. For example, the material of the firstdielectric layer 212 is different than the material of the first CESL210. In some embodiments, CESLs, such as the first CESL 210 and thesecond CESL 220 include silicon and nitrogen, such as silicon nitride orsilicon oxynitride. The ILD layers and/or CESLs are formed oversubstrate 22, for example, by a deposition process (such as CVD, PVD,ALD, HDPCVD, MOCVD, RPCVD, PECVD, LPCVD, ALCVD, APCVD, plating, othersuitable methods, or combinations thereof). In some implementations, ILDlayers and/or CESLs are formed by a flowable CVD (FCVD) process thatincludes, for example, depositing a flowable material (such as a liquidcompound) over substrate 22 and converting the flowable material to asolid material by a suitable technique, such as thermal annealing and/orultraviolet radiation treating. Subsequent to the deposition of ILDlayers and/or CESLs, a CMP process and/or other planarization process isperformed, such that ILD layers and/or CESLs have substantially planarsurfaces for enhancing formation of overlying layers.

At block 102 of the method 100, contact features 1000, 2000 and 3000 areformed in the first dielectric layer 212. Contact features 1000, 2000and 3000 represent BEOL contact features that interface MEOLdevice-level contacts, such as gate contacts electrically coupled togate structures and source/drain contacts electrically coupled to theepitaxial source/drain features. In some embodiments illustrated in FIG.2, the contact features 1000, 2000 and 3000 may include a barrier layer214, a liner 216 and a metal fill layer 218. In some implementations,the barrier layer 214 may be formed of Ta, TaN, TaC, Ti, TiN, TiC, andother suitable material that can block oxygen diffusion. The liner 216may be formed of suitable metal, metal nitride, or metal carbide, suchas Co, CoN and RuN. The metal fill layer 218 may be formed of anysuitable conductive material, such as W, Ni, Ta, Ti, Al, Cu, Co, TaN,TiN, Ru, and/or other suitable conductive materials. In someembodiments, the contact features 1000, 2000 and 3000 may be formed bypatterning the first dielectric layer 212 and the first CESL 210.Patterning the first dielectric layer 212 and first CESL 210 can includelithography processes and/or etching processes to form via openings. Insome implementations, the lithography processes include forming a resistlayer over the first dielectric layer 212 and/or first CESL 210,exposing the resist layer to pattern radiation, and developing theexposed resist layer, thereby forming a patterned resist layer that canbe used as a masking element for etching openings in the firstdielectric layer 212 and/or first CESL 210. The etching processesinclude dry etching processes, wet etching processes, other etchingprocesses, or combinations thereof. Thereafter, the opening(s) arefilled with the barrier layer 214, the liner 216, and the metal filllayer 218. In some embodiments, the barrier layer 214 may be depositedusing atomic layer deposition (ALD), chemical vapor deposition (CVD), orelectroless deposition (ELD) and may be formed to a thickness betweenabout 0.5 nm and about 5 nm. In some implementations, the liner 216 maybe deposited using ALD, CVD, ELD, or physical vapor deposition (PVD) andmay be formed to a thickness between about 0.5 nm and 3 nm. In someinstances, the metal fill layer 218 may be deposited using PVD, CVD,ALD, electroplating, ELD, or other suitable deposition process, orcombinations thereof. Thereafter, any excess material(s) can be removedby a planarization process, such as a CMP process, thereby planarizingtop surfaces of the first dielectric layer 212, the barrier layer 214,the liner 216, and the metal fill layer 218.

After the top surfaces of the first dielectric layer 212, the barrierlayer 214, the liner 216, and the metal fill layer 218 are planarized,the second CESL 220 may be deposited over the first dielectric layer 212and a second dielectric layer 222 may be deposited over the second CESL220. The second CESL 220 may be formed using materials and processessimilar to those used for forming the first CESL 210. For simplicity,the formation and materials of second CESL 220 are not repeated here.Similarly, the second dielectric layer 222 may be formed using materialsand processes similar to those used for forming the first dielectriclayer 212 and is not described further here.

Referring still to FIGS. 1A and 2, the method 100 includes a block 104where a trench 226 and a via opening 224 may be formed in the seconddielectric layer 222 and through the second CESL 220. In someembodiments, the trench 226 is larger than the via opening 224 indimensions along the X direction and/or the Y direction. The trench 226may be utilized to form a conductive line (or metal line) that extendsalong the X direction or the Y direction. In some representativeimplementations shown in FIG. 2, the contact feature 2000 is exposedthrough the via opening 224 in the bottom surface of the trench 226.

Referring to FIGS. 1A and 3, the method 100 may optionally include ablock 106 where a reset layer 228 may be formed over the exposed contactfeature 2000. The reset layer 228 is a conductive layer and has acomposition different from that of the barrier layer 214, the liner 216,or the metal fill layer 218. The reset layer 228 functions as a layer to“reset” the surface property of the exposed contact feature 2000. Aswill be described below with respect to block 108, in some embodiments,a self-assembled monolayer (SAM) 230 may be deposited on the exposedcontact feature 2000. However, in some embodiments, the SAM 230 may notbe selectively formed directly on the exposed contact feature 2000, suchas the exposed first metal fill layer 218. In those embodiments, thereset layer 228 that is deposited on the contact feature 2000 wouldbecome an interface or façade of the underlying top surface of thecontact feature 2000. In some implementations, the reset layer 228 maybe formed of cobalt or ruthenium and may be formed using ALD, CVD or ELDto a thickness between about 0.5 nm and 5 nm. In some implementations,the formation of the reset layer 228 does not include any lithographysteps and is performed in a selective, bottom-up, or self-alignedmanner. In that regard, the precursors and formation process of thereset layer 228 are selected such that the precursors selectivelydeposit on the metal/metal nitride surface of the exposed contactfeature 2000 and the reset layer 228 thickens from the bottom up. Insome instances, the dielectric sidewalls of the via opening 224 and thetrench 226 may be substantially free of the reset layer 228.

Referring to FIGS. 1A, 4A and 4B, the method 100 includes a block 108where a self-assembled monolayer (SAM) 230 is formed over the exposedcontact feature 2000. In the embodiments illustrated in FIG. 4A, the SAM230 is formed directly on the exposed contact feature 2000. Inembodiments where the reset layer 228 is formed, the SAM 230 is formeddirectly on the reset layer 228. The SAM 230 may be formed of a moleculethat includes a head group (or anchor) and a tail group. In someinstances, the head group may include phosphorus (P), sulfur (S), orsilicon (Si), which in some cases may be in the form of phosphate,sulfate, or silane based substances. The tail group may include a carbonchain, such as one including alkenes and alkynes. In some examples, themolecule forming the SAM 230 (or the head group of the molecule for theSAM 230) may include ODPA (Octadecylphosphonic acid), organosulfurs, orthiols (e.g., dodecanethiol, alkanethiol). In some otherimplementations, the molecule forming the SAM 230 may include(3-aminopropyl)triethoxysilane (APTES). In some instances, the SAM 230is attachable to a conductive layer, such as the reset layer 228, theliner 216 and the metal fill layer 218 but does not substantially attachto the surfaces of the second CESL 220 and the second dielectric layer222, which are formed of dielectric materials.

Referring to FIGS. 1A, 5A and 5B, the method 100 includes a block 110where the first barrier layer 232 is selectively deposited over surfacesof semiconductor device 20 except for surfaces covered by the SAM 230.In some embodiments, the precursors and processes for formation of thefirst barrier layer 232 are selected such that that the first barrierlayer 232 is selectively deposited on surfaces of the second dielectriclayer 222, including sidewalls of the via opening 224 and the trench 226and the top surface of SAM 230 is substantially free of the firstbarrier layer 232. In this regard, because precursors of the firstbarrier layer 232 have low affinity to the SAM 230 (i.e. the SAM 230repels the precursors of the first barrier layer 232), the SAM 230functions as a blocking layer or a hinderance layer for the firstbarrier layer 232. In some embodiments, the first barrier layer 232 maybe formed of Ta, TaN, TaC, Ti, TiN, TiC, and other suitable materialthat can block oxygen diffusion, and may be deposited using ALD, CVD, orELD and may be formed to a thickness between about 0.5 nm and about 5nm. The reset layer 228 is formed in the embodiments illustrated in FIG.5B but is not in the embodiments illustrated in FIG. 5A.

Referring to FIGS. 1A, 6A, 6B, 7A, and 7B, the method 100 include ablock 112 where the SAM 230 is removed. In some embodiments, the SAM 230may be removed by selective etching or annealing, such as the annealoperation 231 diagrammatically illustrated in FIGS. 6A and 6B. In someembodiments, the anneal operation 231 for removal of the SAM 230 may beperformed at about 200° C. and about 400° C. As illustrated in FIG. 7A,in embodiments where the reset layer 228 is not formed, the contactfeature 2000 is exposed after the SAM 230 is removed. In embodimentswhere the reset layer 228 is formed, the reset layer 228 is exposedafter the SAM 230 is removed, as illustrated in FIG. 7B.

Referring to FIG. 1A, the method 100 may include a block 107 in place ofblocks 106, 108, 110, and 112. At block 107, a self-aligned barrierlayer may be selectively deposited over sidewalls of the seconddielectric layer 222 to form a structure similar to but not identical tothat shown in FIG. 7A. In those embodiments, precursors of theself-aligned barrier layer include a functional group that has astronger affinity to the second dielectric layer 222 than to the contactfeatures 2000 and can be used to selectively form the self-alignedbarrier layer only on the second dielectric layer 222 in a suitabledeposition process, such as CVD, ALD, electroless deposition, or spin-oncoating. In some embodiments, the self-aligned barrier layer may includean oxygen-containing dielectric layer such as aluminum oxide orfunctional groups of self-assembled monolayer, such as APTES. Due to theself-alignment nature of the self-aligned barrier layer, the exposedcontact features 2000 is substantially free of the self-aligned barrierlayer upon conclusion of block 107. It is noted while FIG. 7Aillustrates a similar structure, the composition of the first barrierlayer 232 as shown in FIG. 7A is different from the composition of theself-aligned barrier layer.

Referring to FIGS. 1B, 8A and 8B, the method 100 includes a block 114where a first liner 234 is deposited over the contact feature 2000 andthe first barrier layer 232. In some implementations, the first liner234 may be deposited using ALD, CVD, ELD, or PVD and may be formed to athickness between about 0.5 nm and 3 nm. The first liner 234 may beformed of suitable metal, metal nitride, or metal carbide, such as Co,CoN and RuN.

Referring still to FIGS. 1B, 8A and 8B, the method 100 includes a block116 where a contact metal fill layer 236 is deposited over the firstliner 234 to fill both the via opening 224 and the trench 226. Thecontact metal fill layer 236 may be formed of any suitable conductivematerial, such as W, Ru, Ni, Ta, Ti, Al, Cu, Co, TaN, TiN, and/orcombinations thereof. As illustrated in FIG. 8A, an interface betweenthe contact feature 2000 and the contact metal fill layer 236 includesthe first liner 234 and is free or substantially free of the firstbarrier layer 232 that has a high resistance.

Referring to FIGS. 1B, 7C, 8C, and 9C, the method 100 may alternativelyinclude block 113, 115, 117, and 119 in place of blocks 114 and 116. Atblock 113, a via metal fill layer 242 is deposited in the via opening224. The via metal fill layer 242 may be formed of W, Ru, Ni, Ta, Ti,Al, Cu, Co, TaN, TiN, and/or combinations thereof and may be formedusing PVD, CVD, ALD, electroplating, ELD, or other suitable depositionprocess, or combinations thereof. In some embodiments represented inFIGS. 7C, 8C and 9C, the via metal fill layer 242 is deposited on thereset layer 228. However, the present disclosure is not so limited andthe via metal fill layer 242 may be deposited directly on the exposedcontact feature 2000. In some implementations, the via metal fill layer242 may be selectively deposited on the reset layer 228 or the contactfeature 2000 in a bottom-up manner such that the via metal fill layer242 selectively deposits in the via opening 224 along the Z directionwithout lodging on sidewalls of the trench 226. In some instances, thedeposition of the via metal fill layer 242 may include one or more etchback operations to ensure quality of the via metal fill layer 242. Here,quality of the via metal fill layer 242 at least means low resistivity(or high conductivity) of the via metal fill layer 242. The etch backoperations may prevent formation of voids or defects that may adverselyimpact the conductivity of the via metal fill layer 242. In theembodiments illustrated in FIGS. 7C, 8C and 9C, an interface between thevia metal fill layer 242 and the contact feature 2000 is free of anybarrier layer and may or may not include reset layer 228. It is notedthat, in these alternative embodiments, no planarization is performed onthe via metal fill layer 242 until the trench 226 above the via metalfill layer 242 is filled at blocks 115, 117 and 119. As a result, thetop surface of the via metal fill layer 242 has a convex shape and isnot planarized.

Referring to FIGS. 1B and 8C, the method 100 includes block 115 wherethe second barrier layer 237 is deposited over the via metal fill layer242 and sidewalls of the trench 226. In some embodiments, the secondbarrier layer 237 may be formed of Ta, TaN, TaC, Ti, TiN, TiC, and othersuitable material that can block oxygen diffusion, and may be depositedusing ALD, CVD, or ELD to a thickness between about 0.5 nm and about 5nm. In some embodiments represented in FIG. 8C, the second barrier layer237 is conformally deposited on the first barrier layer 232 alongsidewalls of the trench 226 and on the convex top surface of the viametal fill layer 242.

Referring still to FIGS. 1B and 8C, the method 100 includes block 117where a second liner 239 is formed over the first barrier layer 232. Insome implementations, the second liner 239 may be conformally depositedusing ALD, CVD, ELD, or PVD on the second barrier layer 237 and may beformed to a thickness between about 0.5 nm and 3 nm. The second liner239 may be formed of suitable metal, metal nitride, or metal carbide,such as Co, CoN and RuN.

Referring still to FIGS. 1B and 8C, the method 100 includes block 119where the trench metal fill layer 241 is formed over the first liner234. In some instances, the trench metal fill layer 241 may be depositedusing PVD, CVD, ALD, electroplating, ELD, or other suitable depositionprocess, or combinations thereof. The trench metal fill layer 241 may beformed of any suitable conductive material, such as W, Ni, Ta, Ti, Al,Cu, Co, TaN, TiN, Ru, and/or combinations thereof. In embodimentillustrated in FIG. 3F, among other functions, the first barrier layer232 and the first liner 234 may also function to prevent CMP slurry frompenetrating/seeping through the interface between the via fill layer 242and the second dielectric layer 222 to damage or corrode underlyingstructures, such as the contact feature 2000.

Referring to FIGS. 1B, 9A, 9B, and 9C, the method 100 includes block 120where a planarization process, such as CMP, is performed. The operationsat block 120 provide the interconnect structure 200 with a planar topsurface such that additional interconnect structures may be formedthereon. In some embodiments, the operations at block 120 are performedafter the operations at block 116 or after the operations at block 119.

Referring to FIG. 1B, the method 100 includes block 122 where furtherprocesses are performed. In some embodiments, the further processes mayinclude processes for forming additional interconnect structures overthe interconnect structure 200. For example, such further processes mayinclude deposition of another CESL, deposition of another dielectriclayer, formation of via openings, formation of trenches, deposition ofbarrier layers, deposition of liners, and deposition of metal filllayers.

In still other alternative embodiments illustrated in FIGS. 10-13, themethod 100 may deposit the via metal fill layer 242 without forming thefirst barrier layer 232 over sidewalls of the via opening 224 and thetrench 226. In these embodiments, the via metal fill layer 242 is formedof tungsten, ruthenium, or other metal that is less susceptible tooxidation due to oxygen diffusion. In an implementation, after the resetlayer 228 is deposited at block 106, the method 100 may proceed directlyto blocks 113, 115, 117, and 119. In that example, the via metal filllayer 242 is deposited directly on the reset layer 228 and the seconddielectric layer 222 along sidewalls of the via opening 224. The resetlayer 228 here does not so much serve to reset the surface property ofthe contact feature 2000 but rather functions as an interfacial layer topromote adhesion of the via metal fill layer 242 to the contact feature2000. While the reset layer 228 is illustrated in FIGS. 10-13, thepresent disclosure is not so limited and include embodiments where thereset layer 228 is omitted and the via metal fill layer 242 is formeddirectly on the exposed surface of the contact feature 2000. Asillustrated in FIG. 10, similar to the operations at block 113, the viametal fill layer 242 is formed in a bottom-up manner and may have aconvex top surface. The second barrier layer 237 in FIG. 11 may then beconformally deposited over sidewalls of the second dielectric layer 222and the convex top surface of the via metal fill layer 242, inoperations similar to those at block 115. The second liner 239 in FIG.12 may be conformally deposited over the second barrier layer 237, inoperations similar to those at block 117. Thereafter, the trench metalfill layer 241 in FIG. 12 may be deposited over the second liner 239, inoperations similar to those at block 119. The top surface of theworkpiece is then planarized using a suitable process, such as CMP, inoperations similar to those at block 120. It is noted that theplanarization does not apply directly to the via metal fill layer 242that is not lined with any barrier layer but applies to the trench metalfill layer 241, the second liner 239, the second barrier layer 237, andthe second dielectric layer 222. The second barrier layer 237 preventsany CMP (or planarization chemicals) from penetrating/seep through theinterface between the via metal fill layer 242 and the second dielectriclayer 222, thereby protecting the underlying contact features (such ascontact feature 2000) from being damaged.

Reference is now made to FIGS. 14A and 14B, the present disclosure alsoprovides a method 300 for fabricating a MEOL contact structure. Method300 is described in conjunction with FIGS. 15, 16, 17A, 17B, 18A, 18B,19A, 19B, 20A, 20B, 21A, 21B, 22A, and 22B, which are fragmentarycross-sectional views of an MEOL contact structure on a workpiece 400 atvarious stages of fabrication according to various embodiments of method300 of the present disclosure. Additional steps can be provided before,during, and after method 300, and some of the steps described can bemoved, replaced, or eliminated for additional embodiments of method 300.

Additionally, operations in method 300 may bear resemblance to those inmethod 100 and some details may be omitted.

Referring now to FIGS. 14A, 15 and 16, the method 300 includes a block302 where a via opening 430 is formed in a first dielectric layer 428 ona workpiece 400 to expose a contact feature, such as a source/draincontact capping layer 424. As illustrated in FIG. 15, the workpiece 400includes a substrate 402, a fin structure 404, one or more gatestructure 410 over channel regions of the fin structure 404, one or moresource/drain contact 420 over source/drain region of the fin structure.As the substrate 402, fin structure 404, and gate structure 410 may besimilar to substrate, fin structures, and gate structures describedabove in conjunction with FIG. 2, detailed descriptions thereof will notbe repeated here. In some embodiments, each of the gate structures 410includes a gate electrode 412, a gate capping layer 418, and a gateself-aligned contact (SAC) dielectric layer 420. In addition, one ormore gate spacers may be formed over sidewalls of the gate structures410. In the implementations shown in FIG. 15, a first spacer 414 isdisposed on sidewalls of the gate structure 410 and a second spacer 416is disposed over the first spacer 414. The source/drain contact 420 maybe disposed between two gate structures 410 and may be lined with abarrier layer 422. In some implementations, the source/drain contact 420is capped by a source/drain contact capping layer 424. In someinstances, the gate capping layer 418 and the source/drain capping layer424 may be formed of a metal nitride, such as titanium nitride (TiN),tantalum nitride (TaN), tungsten nitride (W₂N), titanium silicon nitride(TiSiN), tantalum silicon nitride (TaSiN), or combinations thereof. Insome embodiments, a source/drain contact SAC dielectric layer 426 may beformed over the source/drain capping layer 424. The source/drain contactSAC dielectric layer 426 may be formed of an oxygen-containingdielectric layer, such as silicon oxide, silicon oxynitride, or siliconoxycarbonitride. A first dielectric layer 428 is formed over thesource/drain contact SAC dielectric layer 426. The first dielectriclayer 428 in FIG. 15 is similar to the first and second dielectriclayers 212 and 222 in FIG. 2 and detailed descriptions thereof will notbe repeated. It is noted that while method 300 is described inassociation with formation of a contact structure electrically coupledto the source/drain contact 420 illustrated in FIGS. 15, 16, 17A, 17B,18A, 18B, 19A, 19B, 20A, 20B, 21A, 21B, 22A, and 22B, a person ofordinary skill in the semiconductor art would appreciate that method 300is applicable to formation of a contact structure electrically coupledto the gate electrode 412.

Referring to FIGS. 14A and 17A, the method 300 may skip from block 302directly to block 312 where a via metal fill layer 432 is deposited inthe via opening 430 in a bottom-up manner using CVD, ALD, or othersuitable method. The via metal fill layer 432 is in direct contact withexposed sidewalls of the first dielectric layer 428 and the source/draincontact SAC dielectric layer 426 and is not protected by any barrierlayer that may block oxygen diffusion. In some embodiments, the viametal fill layer 432 may be formed of a metal that is less susceptibleto oxidation. In some instances, the via metal fill layer 432 mayinclude tungsten, ruthenium, or other suitable metal.

Referring to FIGS. 14A and 17B, the method 300 includes a block 304where a reset layer 425 is optionally formed over the exposedsource/drain contact capping layer 424. As described above with respectto method 100, the reset layer 425 may or may not be needed to provide asurface for attachment to the SAM layer to be formed in block 306. Atblock 306, a SAM layer (not shown) is formed over the source/draincontact capping layer 424. In embodiments where the reset layer 425 isformed, the SAM layer is formed on the reset layer 425. In otherembodiments where the reset layer 425 is not formed, the SAM is formedon the source/drain contact capping layer 424. As the SAM layer formedover the source/drain contact capping layer 424 prevents deposition ofthe first barrier layer 434, at block 308 of the method 300, the firstbarrier layer 434 is selectively deposited on exposed sidewalls of thesource/drain contact SAC dielectric layer 426 and exposed sidewalls ofthe first dielectric layer 428. The method 300 also includes a block 310where the SAM layer is removed.

Referring to FIG. 14A, in some alternative embodiments, the method 300may include a block 307 in place of blocks 304, 306, 308, and 310. Theblock 307 of the method 300 includes selectively depositing aself-aligned barrier layer over sidewalls of the via opening 430. Inthose alternative embodiments, precursors of the self-aligned barrierlayer include a functional group that has a stronger affinity to thefirst dielectric layer 428 and the source/drain contact SAC dielectriclayer 426 than to the source/drain contact capping layer 424 and can beused to selectively form the self-aligned barrier layer only onsidewalls of the via opening 430 in a suitable deposition process, suchas CVD or ALD. In some embodiments, the self-aligned barrier layer mayinclude an oxygen-containing dielectric layer such as aluminum oxide orfunctional groups of self-assembled monolayer, such as APTES. Due to theself-alignment nature of the self-aligned barrier layer, the exposedsource/drain contact capping layer 424 is substantially free of theself-aligned barrier layer upon conclusion of block 307. The resultingstructure is different from the structure shown in FIG. 17B in that thereset layer 425 is omitted and the self-aligned barrier layer has acomposition different from the composition of the first barrier layer434. In some implementations, the self-aligned barrier layer is selectedsuch that it has smaller oxygen out-diffusion than silicon oxide.Additionally, in some implementations, a liner that is similar to theliner 216 described above may be deposited over the self-aligned barrierlayer to improve interfacial adhesion and to prevent oxygen diffusion.

Referring to FIGS. 14A and 17B, the method 300 may proceed from block310 to block 312 where a metal fill layer 436 is deposited in the viaopening 430. In some embodiments, the metal fill layer 436 may be formedof any suitable conductive material, such as W, Ni, Ta, Ti, Al, Cu, Co,TaN, TiN, and/or other suitable conductive materials.

Referring now to FIGS. 14A, 18A and 18B, the method 300 includes a block314 where a planarization process is performed such that the firstbarrier layer 434 and the metal fill layer 436 formed over top surfacesof the first dielectric layer 428 are removed. With respect to theembodiments represented in FIG. 18A, top surfaces of the firstdielectric layer 428 and the metal fill layer 432 are coplanar. Withrespect to the embodiments represented in FIG. 18B, top surfaces of thefirst dielectric layer 428, the first barrier layer 434, and the metalfill layer 436 are coplanar.

Referring to FIGS. 14B, 19A and 19B, the method 300 includes a block 316where a second dielectric layer 438 is deposited over the via metal filllayer 432 shown in FIG. 19A or the via metal fill layer 436 in FIG. 19B.The second dielectric layer 438 may be similar to the first and seconddielectric layers 212 and 222 in FIG. 2 and detailed descriptionsthereof will not be repeated. In some instances, a planarization processmay be performed to provide the second dielectric layer 438 with aplanarized top surface.

Referring to FIGS. 14B, 20A, and 20B, the method 300 includes a block318 where a trench 440 is formed in the second dielectric layer 438 toexpose the via metal fill layer 432 in FIG. 20A or the via metal filllayer 436 (along with top surfaces of the first barrier layer 434) inFIG. 20B.

Referring to FIGS. 14B and 21A, the method 300 may proceed from block318 to block 323 where a self-aligned barrier layer 444 is formed oversidewalls of the second dielectric layer in the trench 440. Theformation and composition of the self-aligned barrier layer 444 has beendescribed above and will not be repeated here. As illustrated in FIG.21, the self-aligned barrier layer 444 is only formed on surfaces of thefirst dielectric layer 428 and the second dielectric layer 438. The topsurface of the via metal fill layer 432 is substantially free of theself-aligned barrier layer 444. In some implementations, a liner that issimilar to the liner 216 described above may be deposited over theself-aligned barrier layer 444 to improve interfacial adhesion and toprevent oxygen diffusion.

Referring to FIGS. 14B and 21B, the method 300 may proceed from block318 to block 320 where a reset layer 442 is formed over the exposed viametal fill layer 436. From block 318, the method 300 may proceed toblock 322 where a SAM layer (not shown) is formed over the exposed viametal fill layer 436 for the purposes of selective deposition of asecond barrier layer 446 in block 324. Then, at block 324 of the method300, a second barrier layer 446 is selectively deposited over surfacesexcept for surfaces covered by the SAM layer. After the selectivedeposition of the second barrier layer 446, the method 300 includes ablock 326 where the SAM layer is removed. In some implementations, afterthe SAM layer is removed, a liner that is similar to the liner 216described above may be deposited over the second barrier layer 446 ifthe liner may further improve interfacial adhesion or prevent oxygendiffusion.

Referring now to FIGS. 14B, 22A and 22B, the method 300 may proceed fromeither block 323 or block 328 to a block 328 where a trench metal filllayer 448 is formed over the self-aligned barrier layer 444 in FIG. 22Aor the second barrier layer 446 in FIG. 22B. As illustrated in FIGS. 22Aand 22B, the method 300 includes a block 330 where a planarizationprocess is performed to provide planar top surfaces.

The interconnect structures, contact structures and method disclosedherein provide several benefits. In some embodiments, by either use of aSAM to block formation of a barrier layer or a self-aligned barrierlayer, the interface between different contact features or differentinterconnect layers is free of any barrier layer while sidewalls of thecontact vias and trenches are lined by barrier layers. In thoseembodiments, the barrier layer prevents diffusion of oxygen fromdielectric layers but stays out of the conduction path to reduceresistance. In some other embodiments where a via opening is exposed ona bottom surface of a trench, the via metal fill layer is selectivelydeposited in the via opening in a bottom-up manner and a barrier-linedmetal line is formed in the trench. In these embodiments, thebarrier-lined metal line over the contact via prevent harmful processchemicals, such as CMP slurries, from seeping or penetrating through theinterface between the contact via and the dielectric layer surroundingthe contact via. The barrier-lined metal line therefore can protectunderlying structures from being damaged by process chemicals.

The present disclosure provides for many different embodiments. In oneembodiment, an interconnect structure is provided. The interconnectstructure includes a first contact feature in a first dielectric layer,a second dielectric layer over the first dielectric layer, a secondcontact feature over the first contact feature, a barrier layer betweenthe second dielectric layer and the second contact feature, and a linerbetween the barrier layer and the second contact feature. An interfacebetween the first contact feature and the second contact featureincludes the liner and is free of the barrier layer.

In some embodiments, the barrier layer includes tantalum, tantalumnitride, tantalum carbide, titanium, titanium nitride, titanium carbide,or combinations thereof. In some embodiment, the liner includes cobalt,cobalt nitride, ruthenium nitride, or combinations thereof. In someembodiments, the interconnect structure further includes a conductivelayer between the liner and the first contact feature. In someimplementations, the conductive layer includes ruthenium or tungsten. Insome instances, the second contact feature includes a first conductivematerial and the conductive layer includes a second conductive materialdifferent from the first conductive material. In some implementations,the first conductive material includes nickel, tantalum, titanium,aluminum, copper, cobalt, ruthenium, and tungsten.

In another embodiment, an interconnect structure is provided. Theinterconnect structure includes a first contact feature in a firstdielectric layer, a second contact feature in a second dielectric layerover the first dielectric layer. The second contact feature includes acontact via portion, a conductive line portion, and a second barrierlayer. The contact via portion includes a reset layer directly on thefirst contact feature and a first metal fill layer over the reset layer.The conductive line portion includes a first barrier layer over thefirst metal fill layer, a liner over the first barrier layer, and asecond metal fill layer over the liner. The second barrier layer isdisposed between the second contact feature and the second dielectriclayer. In some embodiments, the first barrier layer includes tantalum,tantalum nitride, tantalum carbide, titanium, titanium nitride, titaniumcarbide, or combinations thereof. In some embodiments, the secondbarrier layer comprises tantalum, tantalum nitride, tantalum carbide,titanium, titanium nitride, titanium carbide, or combinations thereof.In some embodiments, the liner includes cobalt, cobalt nitride,ruthenium nitride, or combinations thereof. In some instances, the resetlayer includes cobalt or ruthenium. In some implementations, the firstcontact feature includes a first conductive material and the reset layerincludes a second conductive material different from the firstconductive material. In some instances, the first contact feature andthe second metal fill layer are formed of the same conductive material.In some embodiments, a top surface of the conductive line portion isplanar and a top surface of the contact via portion is convex in shape.

In still another embodiment, a method is provided. The method includesforming a first contact feature in a first dielectric layer; forming avia opening and a trench in a second dielectric layer over the firstdielectric layer; selectively forming a first barrier layer oversidewalls of the via opening and the trench such that a top surface ofthe first contact feature is free of the first barrier layer; depositinga liner within the via opening and the trench; and depositing a firstmetal fill layer over the liner.

In some implementations, the selectively forming of the first barrierlayer includes depositing a self-assembled monolayer (SAM) on the firstcontact feature; depositing the first barrier layer over sidewalls ofthe via opening using a precursor; and performing an anneal to removethe SAM. The SAM repels the precursor. In some instances, theselectively forming of the first barrier layer includes depositing areset layer over the first contact feature; and depositing aself-assembled monolayer (SAM) on the reset layer. In some embodiments,the method further includes after the forming of the first barrier layerand before the depositing of the liner, depositing a second metal filllayer over the first contact feature. In some instances, the methodfurther includes depositing a second barrier layer over the liner.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method, comprising: forming a via opening in afirst dielectric layer to expose a contact feature; forming a firstreset layer over the exposed contact feature; depositing a firstself-assembled monolayer (SAM) layer on the first reset layer; after thedepositing of the first SAM layer, selectively depositing a firstbarrier layer on surfaces other than surfaces of the first SAM layer;removing the first SAM layer; depositing a via metal fill layer in thevia opening to couple to the first reset layer; depositing a seconddielectric layer over the via metal fill layer; forming a trench in thesecond dielectric layer to expose the via metal fill layer; forming asecond reset layer over the exposed via metal fill layer; depositing asecond SAM layer over the second reset layer; after the depositing ofthe second SAM layer, selectively depositing a second barrier layer onsurfaces other than surfaces of the second SAM layer; removing thesecond SAM layer; and depositing a trench metal fill layer over thetrench.
 2. The method of claim 1, wherein the first reset layer and thesecond reset layer comprise cobalt or ruthenium.
 3. The method of claim1, wherein the first SAM layer the second SAM layer comprise a moleculethat includes a head group and a tail group, wherein the head groupcomprises phosphorus (P), sulfur (S), or silicon (Si) and the tail groupcomprises a carbon chain.
 4. The method of claim 3, wherein the moleculecomprises ODPA (Octadecylphosphonic), organosulfurs, dodecanethiol,alkanethiol, or 3-aminopropyl)triethoxysilane (APTES).
 5. The method ofclaim 1, wherein the contact feature comprises a source/drain contactand a source/drain contact capping layer disposed on the source/draincontact, wherein the forming of the via opening exposes the source/draincontact capping layer.
 6. The method of claim 5, wherein thesource/drain contact capping layer comprises titanium nitride (TiN),tantalum nitride (TaN), tungsten nitride (W₂N), titanium silicon nitride(TiSiN), tantalum silicon nitride (TaSiN).
 7. The method of claim 5,wherein the source/drain contact is disposed between a first gatestructure and a second gate structure, wherein the source/drain contact,the first gate structure and the second gate structure are disposed overa fin structure.
 8. A method, comprising: forming a via opening in afirst dielectric layer to expose a contact feature; forming a firstreset layer over the exposed contact feature; selectively depositing afirst barrier layer on surfaces of the first dielectric layer;depositing a via metal fill layer in the via opening to couple to thefirst reset layer; depositing a second dielectric layer over the viametal fill layer; forming a trench in the second dielectric layer toexpose the via metal fill layer; forming a second reset layer over theexposed via metal fill layer; selectively depositing a second barrierlayer on surfaces of the second dielectric layer; and depositing atrench metal fill layer over the trench.
 9. The method of claim 8,wherein the first reset layer and the second reset layer comprise cobaltor ruthenium.
 10. The method of claim 8, wherein the selectivelydepositing of the first barrier layer comprises: depositing a firstself-assembled monolayer (SAM) layer on the first reset layer, and afterthe depositing of the first SAM layer, selectively depositing the firstbarrier layer on surfaces other than surfaces of the first SAM layer,wherein the selectively depositing of the first barrier layer comprisesuse of a precursor, wherein the precursor has low affinity to the firstSAM layer.
 11. The method of claim 10, wherein the first SAM layercomprises a molecule that includes a head group and a tail group,wherein the head group comprises phosphorus (P), sulfur (S), or silicon(Si) and the tail group comprises a carbon chain.
 12. The method ofclaim 11, wherein the molecule comprises ODPA (Octadecylphosphonic),organosulfurs, dodecanethiol, alkanethiol, or3-aminopropyl)triethoxysilane (APTES).
 13. The method of claim 8,wherein the selectively depositing of the second barrier layercomprises: depositing a second self-assembled monolayer (SAM) layer onthe second reset layer; and after the depositing of the second SAMlayer, selectively depositing the second barrier layer on surfaces otherthan surfaces of the second SAM layer, wherein the selectivelydepositing of the second barrier layer comprises use of a precursor,wherein the precursor has low affinity to the second SAM layer.
 14. Themethod of claim 8, wherein the contact feature comprises a source/draincontact and a source/drain contact capping layer disposed on thesource/drain contact, wherein the forming of the via opening exposes thesource/drain contact capping layer.
 15. The method of claim 14, whereinthe source/drain contact capping layer comprises titanium nitride (TiN),tantalum nitride (TaN), tungsten nitride (W₂N), titanium silicon nitride(TiSiN), tantalum silicon nitride (TaSiN).
 16. A method comprising:forming a first contact feature in a first dielectric layer; forming avia opening and a trench in a second dielectric layer over the firstdielectric layer; selectively forming a first barrier layer oversidewalls of the via opening and the trench such that a top surface ofthe first contact feature is free of the first barrier layer; depositinga liner within the via opening and the trench; and depositing a firstmetal fill layer over the liner.
 17. The method of claim 16, wherein theselectively forming of the first barrier layer comprises: depositing aself-assembled monolayer (SAM) on the first contact feature; depositingthe first barrier layer over sidewalls of the via opening using aprecursor; and performing an anneal to remove the SAM, wherein the SAMrepels the precursor.
 18. The method of claim 16, wherein theselectively forming of the first barrier layer comprises: depositing areset layer over the first contact feature; and depositing aself-assembled monolayer (SAM) on the reset layer.
 19. The method ofclaim 16, further comprising: after the forming of the first barrierlayer and before the depositing of the liner, depositing a second metalfill layer over the first contact feature.
 20. The method of claim 19,further comprising depositing a second barrier layer over the liner.